I work for a company that specializes in high tempature electronics >250c. Current off the shelf can only survive<85c, so assume the F1 cars are using airflow or liquid cooling to keep their systems functioning.
Does anyone have a picture or link to electronics that details electronics packaging design. Or have information on a contact who could discuss that. We are a Austin company that wants too see of a concept meeting can be arranged during the F1 race week in NOV.
Outside of the exhaust it's possibl to place more electronics closer to what ever they can dream up placing a sensor on, or most certainly vastly improve reliability - in terms of tempature performance - over what their using now!
Any information provided will be greatly appreciated,
Joshua
Silicon Space Technology